I think that it will be available in New Zealand around early-mid febuary. We got our 4780's about 2 weeks before Sager received theirs.
In reply to interloper - we've sold 20 or so 4780's (remember all of NZ only has 3.7million people), with everything ranging from P4 2.6C, 512mb, 40gb, Combo drive all the way up to P4 3.2C, 1gb, 60gb, DVD-RW.
What I have found is that just idling in windows there isn't much of a differance regarding heat. The fans will come on (at the low setting) for about 30 seconds to 45 seconds every 5 minutes or so. The 3.2 (and to a lesser extent the 3.0) seem to have the fans on for more like 1 minute every 5 minutes.
When playing games however there is a bit of a differance. With a 2.6 or 2.8, the fan will be on constantly, but on it's low settings only. With a 3.0 the fans will occaisonaly step up to the high setting. With a P4 3.2 in there, the fans are on high about half the time.
Now I remember back to 4760 days, with the full size heatsink. Here the fans would spin about 30 seconds every 7 or 8 minutes, even with a P4 3.06ghz in it. When gaming they would never get to the high setting. In fact I remember that in warcraft 3, I once had the fans turn off for one entire minute with a P4 3.06ghz installed!
The other problem with heat is on the left side of the keyboard. This is because the Gigabit chip, northbridge, southbridge, cpu vrm, graphics core, and graphics ram are all attached to a big copper plate that runs the width of the computer. The keyboard sits directly on top of this. Has anyone tried removing their keyboard (4 little tabs at the top) after a heavy gaming session? It must be over 60C, way too hot to touch.
Now, lets compare this to the 4760. In the 4760 you had practically no heat coming from the 10/100 lan chip on it. The realtek 8110 that the 4780 uses gets too hot to touch in a normal desktop system. Imagine how hot it gets in the confines of a laptop.
The 4760 uses a chipset combo that produces about as much heat as the 4780, (sis645dx + 962 up to the 648fx + 963) but remember that the northbridge in the 4780 is running 50% faster than in the 4760. As such I'd imagine it would produce 50% more heat.
The CPU VRM Mosfets are roughly in the middle of this metal plate. These won't be putting out much more power in the new version, remember that the 4760 didn't heat up that much with a P4 3.06ghz, there won't be a sudden huge increase to the P4 3.2ghz.
The graphics card is probably the biggest area of heat increase. ATI said that the Mobile 9600 Pro doesn't produce any more heat that previous generations in idle mode, but they never mentioned anything about it's heat output when playing games. This is also where I've found the biggest increase in the temperature of the metal pad. When doing sandra memory testing (something that focuses on cpu, memory and northbridge) the plate doesn't get that hot, only 50C or so. When we run a 3d loop however there is a huge increase in heat, and in particular the copper plate heats up most over the graphics core and the ram.
Now what is going to happen with the 8790 you ask? Well it will be using the same gigabit chip, and probably the same cpu vrm mosfets. Even if it doesn't, there won't be much of an increase in heat at all in these 2 parts.
The northbridge and southbridge are a huge factor. In a desktop system even with no heatsink on the northbridge, the sis chipset components do not get hot at all. Both are perfectly cool to touch. The intel 865PE on the other hand always ships with a fairly large heatsink, which with no airflow over it gets too hot to touch. The ICH5/R southbridge gets hot, but not uncomfortable to touch. Overall there will be a big increase in the heat output of the chipset components.
The graphics core will definately be hotter. whether it is truly based on the 9700 pro, or if it is based on the 9600XT, the chip will run hotter than the current 9600 pro. Also remember that the new notebook will be shipping with 256mb ram, which will obviously be hotter than the 128mb ram in the 4780.
So overall, I'd say that for the plate under the keyboard there will be a huge increase in heat. I'd also imagine that there will have to be a fan in there somewhere to cool it all down. I know the internal layout off by heart on both the 4760 and 4780, I just can't see how they will be able to put a fan in there, there just simply is no room. Furthermore, in the pics adam has shown us, there doesn't appear to be any extra vents on the notebook at all. I can only assume that they have moved at least the chipset or the graphics card to another part of the notebook. This could possibly be the area towards the front of the notebook, where the hard drive bays are. Either way, I just couldn't beleive that the copper plate will be able to keep the new parts of the 8790 cool. I don't want to get 3rd degree burns every time I use the left hand side of the keyboard.
Lastly, the cpu heatsink. If Clevo are rating it for Prescotts up to 3.6ghz then surely there has to be a return to the larger dual fan heatsink. I'd imagine that with a 3.6ghz cpu, the fan would be on constantly when in idle mode, and probably in the high mode whenever playing a game, if the smaller heatsink was used. Lets hope that doesn't happen.