So after playing FEAR at 90C for the first week of having my 7800GTX, I had had enough, and since I still had alot of 0.025" guage copper left over from the 6800Go in a D810 mod, I decided to put it to good use and do some modding
.
The general problem with all heatsinks from the Dell laptops is that they all are designed to allow a little bit of room between the core and the heatsink. This is because Dell uses those aluminum TIM plates and not paste on their cards (easier when mass producing the cards). Anyway, apply a thick layer of AS5 might drop temps a bit from the stock aluminum plate, but it still doesn't get the job done completely. Taking my heatsink off my 7800GTX, I was surprised to find that there was still a bit of the core that had not made contact with the heatsink, despite the rather thick (comparitively) layer of AS5 I had put on the core. So, on to work. First, I cut out a square just the size of the core and sanded it down with 600grit to remove sharp edges as well remove any finish and oxidation. I then soaked the plate in 91% isoprophyl alcohol to finish the cleaning process:

(Reference picture of copper plate on 6800Go from D810 project)
Next I made a custom design heatsink for the RAM chips on the back of the card. The main problem I found with my initial overclocking and testing of the card is that the RAM has a TON of potential. The chips are coded GC16, which should label them as 1.6ns memory and make them capable of at least 625MHz (1250MHz effective), and I've had them at 1300MHz+ in a cold room. Anyway, they just that get waaaayyy too hot, and the dinky aluminum alloy back bracket isn't going to keep the back side cool enough to keep up with the better cooling of the front. So, here's what I came up with:

*audience gasps, oooos, and ahhhhs*
Yes, yes, it's not pretty but it works. Clamped it down to a 1/4 board and used a jig saw to make the cuts. Only screw up happened when I drilled the hole and the bit nabbed the edge and pulled the copper plate up around the screw hole. I was able to bend it flat again (gotta love copper) but I still had that damn buckle on the lower center portion, bah
.
Anyway, here are the parts laid out:

My original design was to use the stock X-frame bracket that comes with the other Dell cards (this one is from an X600) to secure the heatsink onto the core, and then epoxy the copper RAM heatsink onto the bottom RAM sinks. Here's one of the attempts:

Long story short, no go. I tried thermal epoxy and super glue, neither would secure the plate while still using AS5 as the main heat transferer. So, back to the drawing board
. I was running out of steam (working on 4 hours of sleep from playing Serious Sam 2 with friends all night
), so I just used the original back bracket that came with the Go 7800GTX, which would hold the copper bracket to the RAM sinks. I just hoped that it wouldn't be too thick and start touching the mother board
. So the cooling goes RAM chips>AS5>copper heatsink>thermal pads>original back bracket. Unfortunately it's too thick, but I jimmied the sucker in anyway
. It fully sits in the slot on the motherboard, and only the lower portion (towards the thumbpad) is slightly pushed up higher by the copper heatsink. It doesnt touch the motherboard, looks like it's blocked by the south bridge, so there's some extra cooling there
. Anyway, here's the finished product:

Looks great I think
. I had to rebend some of the fins on the right side to allow more room for the card. Other than that, the first part was done, now the question, would it work? The answer: ohhhhhh yeaaaahhhh 

.
In my dining room where I usually work, it's about 80-85F (27-30C) because it's relatively close to the wood stove. The card used to idle at 48C, now it's sitting at 45C. Load temps used to reach 90-92C in F.E.A.R., now I havent seen them climb above 82C. I would say that's definitely substantial
.
Next is to see how much higher I can overclock (stably), with a special focus on the RAM. I use F.E.A.R. to test my maximum stable clock, as it is the most intensive application I have. Right now my everyday, stable clock is 450/1180. Here's to hitting at least 1250 stably with the RAM
.
.The general problem with all heatsinks from the Dell laptops is that they all are designed to allow a little bit of room between the core and the heatsink. This is because Dell uses those aluminum TIM plates and not paste on their cards (easier when mass producing the cards). Anyway, apply a thick layer of AS5 might drop temps a bit from the stock aluminum plate, but it still doesn't get the job done completely. Taking my heatsink off my 7800GTX, I was surprised to find that there was still a bit of the core that had not made contact with the heatsink, despite the rather thick (comparitively) layer of AS5 I had put on the core. So, on to work. First, I cut out a square just the size of the core and sanded it down with 600grit to remove sharp edges as well remove any finish and oxidation. I then soaked the plate in 91% isoprophyl alcohol to finish the cleaning process:

(Reference picture of copper plate on 6800Go from D810 project)
Next I made a custom design heatsink for the RAM chips on the back of the card. The main problem I found with my initial overclocking and testing of the card is that the RAM has a TON of potential. The chips are coded GC16, which should label them as 1.6ns memory and make them capable of at least 625MHz (1250MHz effective), and I've had them at 1300MHz+ in a cold room. Anyway, they just that get waaaayyy too hot, and the dinky aluminum alloy back bracket isn't going to keep the back side cool enough to keep up with the better cooling of the front. So, here's what I came up with:

*audience gasps, oooos, and ahhhhs*
Yes, yes, it's not pretty but it works. Clamped it down to a 1/4 board and used a jig saw to make the cuts. Only screw up happened when I drilled the hole and the bit nabbed the edge and pulled the copper plate up around the screw hole. I was able to bend it flat again (gotta love copper) but I still had that damn buckle on the lower center portion, bah Anyway, here are the parts laid out:

My original design was to use the stock X-frame bracket that comes with the other Dell cards (this one is from an X600) to secure the heatsink onto the core, and then epoxy the copper RAM heatsink onto the bottom RAM sinks. Here's one of the attempts:

Long story short, no go. I tried thermal epoxy and super glue, neither would secure the plate while still using AS5 as the main heat transferer. So, back to the drawing board
. I was running out of steam (working on 4 hours of sleep from playing Serious Sam 2 with friends all night
), so I just used the original back bracket that came with the Go 7800GTX, which would hold the copper bracket to the RAM sinks. I just hoped that it wouldn't be too thick and start touching the mother board
. So the cooling goes RAM chips>AS5>copper heatsink>thermal pads>original back bracket. Unfortunately it's too thick, but I jimmied the sucker in anyway
. It fully sits in the slot on the motherboard, and only the lower portion (towards the thumbpad) is slightly pushed up higher by the copper heatsink. It doesnt touch the motherboard, looks like it's blocked by the south bridge, so there's some extra cooling there
. Anyway, here's the finished product:
Looks great I think
. I had to rebend some of the fins on the right side to allow more room for the card. Other than that, the first part was done, now the question, would it work? The answer: ohhhhhh yeaaaahhhh 

In my dining room where I usually work, it's about 80-85F (27-30C) because it's relatively close to the wood stove. The card used to idle at 48C, now it's sitting at 45C. Load temps used to reach 90-92C in F.E.A.R., now I havent seen them climb above 82C. I would say that's definitely substantial
.Next is to see how much higher I can overclock (stably), with a special focus on the RAM. I use F.E.A.R. to test my maximum stable clock, as it is the most intensive application I have. Right now my everyday, stable clock is 450/1180. Here's to hitting at least 1250 stably with the RAM
.





. I could easily extend the heatsink upward at the end to attach to the heatpipe, the problem is that the heatpipe would most likely be hotter than the RAM sink and actually HEAT the RAM. Remember that the core still goes up to 75-80C. Although the RAM probably gets close, the air surrounding the heatsink is going to be MUCH cooler than the heatpipe. Judging that the HDD operates at case temp, and the RAM sink is directly next to the HDD, the HDD is now at 33C, and so should be the surround air. 33C is a pretty cold sink for a 75C+ RAM sink to diffuse into. Also remember that the fans are not sealed and that there is some airflow within the case. Since the card is so close to the fan housing, it definitely gets a breeze. Otherwise, I think the HDD would be operating at a much higher temp.
.