Originally Posted by hkancyr
Well it has been 2 weeks and thermally, it has been a non event. It is hard to believe that this thing is so well engineered that the hottest processor around is able to be used with no adverse effects. P.S. The 3.2C is happy in it's new home too. All is well on the 478 pin P4 front. As the 3.4EE gets cheaper it will become a more attractive upgrade for 8890 users. Get one if you can, it will only make a good computer better.
I do a lot of 3d work (rendering at 100% cpu usage for hours on end!) and I bought an 8890 in the fall of '03 with the 3.2 p4 and am looking for a processor upgrade. My machine is already loud as hell (yes, I've cleaned the hsf) so I don't want to go putting an even hotter processor into a system that sounds like a hair dryer... anyway, to the point:
If I plug a 3.4ee into my 8890, can I put a passive skt 478 heasink on the processor. This thing obviously won't move once the hsf is installed and I've already designed a table that will accept a large heatsink sticking out of the bottom of my lappy so that's a non-issue at this point! I'm just wondering if anyone's done this before and what type of results it produced... hopefully lower temps and maybe quiter operation?! The primary concerns for selection of a HSF is the clearance from the top of the processor to the outside of the case... basically, the HSF needs to "lift" itself out of the processor bay and away from the case for the situation to be ideal. It looks like a heat-pipe setup would be best for this.
what passive hsf's would you recommend?
Can I use a directional active hsf and somehow run the fan from the 8890's mobo and blow the hot air from left to right?
could I ask a huge favor of you and get you to run this benchmark. I'm mostly interested in the 3.4's ability to render cg stuff and this benchie tests exactly that!