2GB ... memory modules etc.
Hmm - it seems that everyone is on the page of order their dell machine's with minimum memory, and then getting memory on their own.
This leads me to a few questions I'm hoping people can give me pointers/answers on.
Q1> I assume that the dell memory is slower and/or more expensive than the memory people are getting?
Q2> What is the best laptop memory for the 667 Mhz notebook (brand etc.)? I've heard of OCZ, Mushkin, Crucial, Corsair, Hyniz, Kingston, etc.
Q3> Anyone heard of any good 2GB SO-Dimm DDR memory modules (is 667 DDR2 or DDR3?)? Given what I've read from other posts and articles, it would seem that the i9400 would be able to take 2x2GB (Which would be overkill now, but great when Vista etc. is out).
Q4> Does external/non-Dell memory void the warranty?
Anything else you feel like adding on the memory stakes?
Could be that Hynix has a 2GB module - trying to get it in English as opposed to "memory-speak" http://www.hynix.com/datasheet/eng/d...5PS2G431MP.jsp
Hmm - Samsung maight also have some 2GB notebook modules:http://www.samsung.com/Products/Semi..._ds_200508.pdfhttp://www.samsung.com/Products/Semi...70T5669AZ0.htm
Although it seems to be in "engineering sample" phase of production-= wonder how far that is from normal "for sale" production?
On page 7, they mention:
|256Mx 64 2GB
M470T5669AZ0 LCC/LD5/LE6 st.256Mx 8 * 8pcs 1Gb A-die 1H’06
After reading the doc, basically I interpret that as being 2GB notebook modules available in 1st half 2006, that can run at 667 (5,5,5 speeds)
For the more technically proficient (of which I am not one!):
|DDR2 SDRAM Component Ordering Information
56 : 256Mb
51 : 512Mb
1G : 1Gb
2G : 2Gb
04 : x 4
06 : x 4 Stack
07 : x 8 Stack
08 : x 8
16 : x16
26 : x 4 Stack (JEDEC Standard)
27 : x 8 Stack (JEDEC Standard)
3 : 4 Banks
4 : 8 Banks
3. DRAM Type
5. Bit Organization
6. # of Internal Banks
9. Package Type
10. Temp & Power
1. SAMSUNG Memory : K
2. DRAM : 4
# of Internal Banks
Interface (VDD, VDDQ)
Temp & Power
1 2 3 4 5 6 7 8 9 10 11
T : DDR2 SDRAM
: Commercial Temp.( 0°C ~ 85°C) & Normal Power
: Commercial Temp.( 0°C ~ 85°C) & Low Power
: FBGA (Leaded)
: FBGA (Lead-free)
: 1st Gen.
: 2nd Gen.
: 3rd Gen.
: 4th Gen.
: 5th Gen.
: 6th Gen.
: 7th Gen.
K 4 T X X X X X X X - X X X X
: DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3)
: DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4)
: DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5)
: DDR2-800 (400MHz @ CL=5, tRCD=5, tRP=5)
Q : SSTL-1.8V (1.8V, 1.8V)
7. Interface ( VDD, VDDQ)
Given the following:
|M470T5669AZ0-C(L)E6/D5/CC 2GB 256Mx64 st.256Mx8(K4T2G074QA-C(L)E6/D5/CC)*8 2
I get K4T2G074QA-C(L)E6/D5/CC:
2G=2G : 2Gb (denisty)
07=x 8 Stack
Q=STL-1.8V (1.8V, 1.8V)
A-C=2nd Gen or 4th Gen ??? or
C=Commercial Temp.( 0°C ~ 85°C) & Normal Power
L=Commercial Temp.( 0°C ~ 85°C) & Low Power
E6=DDR2-667 (333MHz @ CL=5, tRCD=5, tRP=5)
D5=DDR2-533 (266MHz @ CL=4, tRCD=4, tRP=4)
CC=DDR2-400 (200MHz @ CL=3, tRCD=3, tRP=3)
which seems to mean the memory can run @400Mhz with 3,3,3 timings, OR 533Mhz with 4,4,4 timings OR 667Mhz with 5,5,5 timings
Ouch! My brain hurts now :-)