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Dropped My Load Temp by 30 Degrees!!!!! - Page 2

post #21 of 40
5/16/06 at 5:14pm
maybe cause we both did it at the same time with each other. same system same results. Also this is maybe the reason y we havent posted before=p
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post #22 of 40
5/16/06 at 5:14pm
Thread Starter 
Me and Malkaven purchased our 6 months ago. We have found the Dell Notebook forums very very helpful. You guys have showed us how to:

PM our CPU
Install a 7800GTX
Tons of tweaks

Last weekend we both got together to get this stuff and try it out. It worked for us and all we wanted to do is share our success with you guys. If we worked for this company, why would I link it from a re-seller webpage? Sadly I have a shitty job as a business development manager for a call center.
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post #23 of 40
5/16/06 at 5:18pm
Quote:
Originally Posted by Flav_cool
Hmm I put on AS3 (which is like older AS5), but I only put it on the core. I also put a very tiny bit (not even 1 rice!) and spread it into a thin sheet (you still can't see the core through it thought). You guys are saying I should put it around on the green PCB surrounding the core too!?

No, you just need to put the Artic Silver on the raised part of the CPU, the little metal piece. The rest does not come into contact with the heatsink, so it's not needed.

When I first applied AS5, I did this. Not knowing, and my temps still got pretty high. So I re did it and it dropped them like 10C lower than normal.
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post #24 of 40
5/16/06 at 5:20pm
The ONLY thing I see here is your STILL using AS5. Regardless if it's directly connected to the CPU or not.

It still has to go through the AS5 inorder to get to the heatsink anyway, which leads me to believe you you applied the AS5 wrong in the other attempts.

Hell, I thought I knew what I was doing when I applied the AS5 on my CPU, but after doing it a second time I noticed a 10C drop in temp, below what I thought to be the lowest I could get under load.
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post #25 of 40
5/16/06 at 5:23pm
For this thread, you would use liquid pro on the CPU not AS5. Put the liquid pro exactly where u would normal use as5. NOT on the green areas of the CPU.
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post #26 of 40
5/16/06 at 5:26pm
No Skillz, heat will rise. The liquid pro is in direct contact of the CPU. then a COPPER block on top of the liquid pro.

technically the copper block is the new heat sink the alum one is only really used because we needed to secure the copper in place.
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post #27 of 40
5/16/06 at 5:28pm
The fact still remains. The thermal transfer is only as good as the weakest component. Not saying you two are lying, but it seems if the AS5 ifn't as good as this new stuff, then the bond between the copper and aluminum with the as5 would limit the transfer of heat from the copper to the aluminum no matter how good the other thermal compond is. The only other consideration is that depending on the size of this copper plate it is also radiating heat like a smaller heatsink.

Without testing it personally on two identical systems myself. I don't see there being a difference. I think there was probably some user error in there somewhere. And perhaps you should also mention the great danger in using that other termal paste. I can short out your board if you're not careful because unlike as5 it is highly conductive!
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post #28 of 40
5/16/06 at 5:28pm
Thread Starter 
Not trying to drop more company names, but we switch from the AS5 to OCZ stuff to see if that worked any better.

this is how we have our systems

CPU - Liquid Pro - Copper Heat Sink - OCZ Thermel Paste - Alum. Stock CPU Heat Sink
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post #29 of 40
5/16/06 at 5:29pm
Here is my .02$

http://reviews.pcapex.com/cooling/co...quid_metal.php

and only 2c better temps for that matter.
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post #30 of 40
5/16/06 at 5:30pm
Quote:
Originally Posted by Malkaven
No Skillz, heat will rise. The liquid pro is in direct contact of the CPU. then a COPPER block on top of the liquid pro.

technically the copper block is the new heat sink the alum one is only really used because we needed to secure the copper in place.

If this in fact true, which it is not, then you have no way to transfer the heat out of the case as the aluminum heatsink is attatched to the pip that leads the heat out to the vents where the fans blow air across it to transfer the heat to the air. If what you are saying is true then you are merely releasing heat into your case, which is not optimal as you could be inadvertanty harming other components of your laptop. IMO.
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post #31 of 40
5/16/06 at 5:33pm
Thread Starter 
I agree with Sir Meili that the bond between the copper>AS5>Aluminum is probably my weak point. Before I cut the copper block in 1/4, I used the whole copper block. My cpu went to 100C really quick when i was using the whole copper block. Once I cut it into quarters did I get a 65C load.
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post #32 of 40
5/16/06 at 5:35pm
Out of curiosity and testing's sake. Did you try CPU>AS5>copper>AS5>Heatsink to see if in fact it was the addition of the copper block that causes the drop and not the liquid metal?
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post #33 of 40
5/16/06 at 5:41pm
Thread Starter 
We never tested just AS5 and a Copper block. I do give credit to the copper in lowering the temp. I saw someone out there make a copper heatsink for their GPU on the 7800GTX. The way I will leave this, I am happy my computer is not a hot blow dryer anymore.
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post #34 of 40
5/16/06 at 5:44pm
Ok, so if it is the Copper then why? The transfer of heat would be probably better without the copper, IMO, since you are now adding more possible locations for failure. Though like I said without running tests I can not be for sure and I don't have 3 or 4 9300s to run tests on, though I would if I had some cash.
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post #35 of 40
5/16/06 at 5:48pm
Quote:
Originally Posted by Sir Meili
Ok, so if it is the Copper then why? The transfer of heat would be probably better without the copper, IMO, since you are now adding more possible locations for failure. Though like I said without running tests I can not be for sure and I don't have 3 or 4 9300s to run tests on, though I would if I had some cash.

Yea, like I said in my pervious post.

I believe they just applied AS5 incorrectly.
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post #36 of 40
5/16/06 at 5:54pm
Quote:
Originally Posted by Skillz
Yea, like I said in my pervious post. I believe they just applied AS5 incorrectly.
Yeah....I know skillz...I'm not trying to step on toes . I'm just trying to get across that they don't need to make assumptions on unproperly tested methods. There were just too many variables and only 2 tests that I could see that were used. 1. CPU>AS5>heatsink (4 times tried) 2. CPU>liquid Metal>Copper shim>AS5>heatsink. There are too many differences between the two to say that that combination they last tried is the ultimate combination for the given out come. It could have been the copper, improperly applied AS5, etc. I think it's awesome that people are trying different things though. Great job guys, I just think more tests are in order to come to a dead set conclusion
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post #37 of 40
5/16/06 at 5:56pm
Copper transfers heat WAY better than alum. The post is about everything we did to get our temps real low.

I did not apply the as5 wrong. It really isnt rocket science on how to apply thermal paste. I'm very computer savy and iver been using thermal paste since i was a kid. I honestly do not believe someone if there claiming there cpu doesnt break 65c w/ the stock alum heat sink and as5 while there system is pin modded to 2.4 and under a full load. Just not happening.
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post #38 of 40
5/16/06 at 6:01pm
Quote:
Originally Posted by Malkaven
Copper transfers heat WAY better than alum. The post is about everything we did to get our temps real low.

I did not apply the as5 wrong. I really isnt recket science on apply thermal paste. I'm very computer savy and iver been using thermal paste since i was a kid. I honestly do not believe someone if there claiming there cpu doesnt break 65c w/ the stock alum heat sink and as5 while there system is pin modded to 2.4 and under a full load. Just not happening.

you are missing one point here. All the copper is doing is transferring heat to the aluminum anyways. So..no matter how good your Copper is, it's not going to transfer heat out of the case any faster than the aluminum will allow it. I'm sorry, you're wrong. The only other cause would be if you are just radiating heat into your case from the copper, which I'm sure is not the best way to do it since the laptop was not meant to handle heat in the case like this, hence why they use a heatsink and a pipe to transfer the heat to the fans.
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post #39 of 40
5/16/06 at 6:06pm
I have a PinMod ~2.4 and I hardly ever see 65C+.

All I have is AS5 applied to my CPU/HS.

Anytime it starts to get higher, I simply take the laptop apart and blow out all the dust.

Then I see normal loads of around 60C.
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post #40 of 40
5/16/06 at 6:38pm
At first I thought you guys might be trying to sell the liquid metal stuff but I don't think so anymore. ;p

There are a number of other reasons that your temps could have dropped as well -- the main one I'm thinking of is that the extra piece of copper is allowing the heatsink to have a firmer grip on the CPU. If it was not tight before it would most definitely have poor performance. In any case, good job. Sometimes it takes a lot of work to get these 1.8->2.4 pinmods functioning.
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