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Heat issues

post #1 of 8
Thread Starter 
As we all know by now, there are heat issues with the Sager 8790/Clevo D870P. The weak part is the inaducate cooling of the GPU (grafic processor). The fans are all controlled via the temperature of the CPU (main processor). A cool running CPU would not be a very good idea? Some of you have chosen a Northwood CPU because it is said to be running cooler than a Prescott. If the fans are not running/running slow/running just part of the time, the GPU will be hot, too hot perhaps. What a pity there are no separate fan for the GPU! The metal plate below the keyboard could have been better designed. I do not know why it is "insulated" with tape on both sides (transparent on the top, a thicker black on the back of it). It have been meantioned earlier that the GPU should not have any thermal paste. Is this really true?

Roger Gustavsson
post #2 of 8
thermal paste is not thick enough so you need to use pads
post #3 of 8
Thread Starter 
There is no thermal pad on the GPU! There are a few "dents" on the metal plate below the keyboard, that fits over various components without thermal compond or thermal tape. The GPU is naked!
post #4 of 8
If you took a few minutes to "look", you will find that a variety of people have applied "Frag Tape" over the chips and between the "indents" on the heat transfer shield that is located below the keyboard.

Take a look at these (I beleive that you had reviewed some in the past)

http://www.notebookforums.com/thread77390.html
http://www.notebookforums.com/thread159742.html
http://www.notebookforums.com/thread56210.html
http://www.notebookforums.com/thread24227.html (last three or four pages)

The GPU's CPU & memory speed settings are not ideal for the hardware and as a result, you will experience artifacting and most likely "excess heat".
post #5 of 8
Thread Starter 
G-Omaha (or ist it Gary?),

Yes, I am familiar with the threads you refer to. Both Inkling and I are a bit confused over the fact that the GPU and Northbridge has no thermal compound at all. Maybe the greyish dirt on top of the GPU is a rest of thermal compound? The blue thermal tape is aplied to four locations. I have also found a thermal tape from Shin Etsu, 0.45 mm thick or so. Distributed by AKASA (www.akasa.com.tw). Product is called AK-TC-11. AKASA also have a thermal compund (AK-450-5G) with a slightly better thermal conductivity than Artic Silver 5, 9.24 W/mK versus 8.9 W/mK. It is far cheaper too.

I am useing the ATI 6.5 drivers which gives a default setting of 405/220 (clock speed/memory). I have not seen any artifacting. I am only interested in keeping my computer as it is, hopefully not distroying itself. There seems to be 6.6 drivers out now. Is it worth trying?
post #6 of 8
I'm still using the 6.1 drivers (I think).

As far as the tape -v- AS5 argument. My stand is that the tape is easier to apply and will result in overall better heat transfer because appling AS5 to the configuration is most likely to leave a ton of "air pokets" and that is a bad thing. I generally used the tape on all surfaces where an "indent" was evident on the heat transfer plate. This has resulted in generally a cool runing machine which tends to idle at about 38C - I have the 3.4 Northwood processor and the room temps are generally in the 76 - 78F range.
post #7 of 8
Thread Starter 
So you have applied the 0.5 mm thick tape even to the "indents" for the GPU and the Northbridge? Will the rest of the tape covered spots still be in contact with the metal plate then? Maybe you have been useing different grades thermal tapes? Sorry, if I am bothering with those questions again.... but I want to be on the safe side.
post #8 of 8
This is the tape that I used: http://www.highspeedpc.com/Merchant2...duct_Code=Frag

I applied to to the GPU, CPU, Commo Chip as well as others. I did not apply it over the GPU memory as that tape is a whole lot thicker. See my review for more details of what I actually did.

Oh, I cut the frag tape in small pieces that were approx 1/2 - 3/4 inch square or rectangular shapes so that the occupied most of the indent space; however, not all of it.
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