I've read different methods in different places of applying AS5. Just wanted to see what you giuys thought and if there is any difference.
Some people said to spread the AS5 evenly and thinly to cover the whole chip/core/whatever, whilst others say just place a blob in the middle and let the heatsink (heatsync?) push it to where contact is made.
I've only ever used the spread method.
What do you guys do?
Some people said to spread the AS5 evenly and thinly to cover the whole chip/core/whatever, whilst others say just place a blob in the middle and let the heatsink (heatsync?) push it to where contact is made.
I've only ever used the spread method.
What do you guys do?






