NVIDIA GPU failure possibly linked to the use of high lead solder:
Source: TomsHardware
Quote:
| According to our sources, the failures are caused by a solder bump that connects the I/O termination of the silicon chip to the pad on the substrate. In Nvidia’s GPUs, this solder bump is created using high-lead. A thermal mismatch between the chip and the substrate has substantially grown in recent chip generations, apparently leading to fatigue cracking. Add into the equation a growing chip size (double the chip dimension, quadruple the stress on the bump) as well as generally hotter chips and you may have the perfect storm to take high lead beyond its limits. Apparently, problems arise at what Nvidia claims to be "extreme temperatures" and what we hear may be temperatures not too much above 70 degrees Celsius. |
i have a evga card which comes with lifetime warranty
