In short: My e1705 with a quadro 2500m is idling at temperatures at least 10 degrees celsius higher than it was before: 70 degrees with slow fans compared to ~60 with slow fans (I had fans kick in at 65 to bring it back to 60). There have been no hardware/software changes to the system.
So I read the guides about applying AS5 to your GPU and I thought I'd try to get better temps. I cleaned off all the old compound from both the GPU and the heat spreader, and placed about a pea-sized piece on the GPU (see attachment). It wasn't the most perfect blob of AS5, but volume-wise I think it was pretty close, and ideally it would be smoothed out when I tightened the screws on the heat spreader. I stuck to a "less is more approach" having heard that all I needed to do was fill the minor imperfections of the contact surfaces.
So what gives?
I did notice the copious amounts of thermal compound that I had to scrape off to clean the surfaces. My theory is that the thermal compound filled the gap between the GPU and the surrounding black square structure (visibile in attachment), and helped conduct heat laterally away from the GPU, instead of just through its face. The copper face on the heat spreader is much larger than the GPU, which tells me that more lateral heat spreading is needed.
Also, I was wondering if anyone has experience undervolting at idle for the GPU. I might not have a chance to fix this right away and I want to do everything I can. I added speculative voltages to the attachment, because .06V increments would make sense to fill the gap between 1 and 1.24.
Any thoughts? Thanks in advance.


So I read the guides about applying AS5 to your GPU and I thought I'd try to get better temps. I cleaned off all the old compound from both the GPU and the heat spreader, and placed about a pea-sized piece on the GPU (see attachment). It wasn't the most perfect blob of AS5, but volume-wise I think it was pretty close, and ideally it would be smoothed out when I tightened the screws on the heat spreader. I stuck to a "less is more approach" having heard that all I needed to do was fill the minor imperfections of the contact surfaces.
So what gives?
I did notice the copious amounts of thermal compound that I had to scrape off to clean the surfaces. My theory is that the thermal compound filled the gap between the GPU and the surrounding black square structure (visibile in attachment), and helped conduct heat laterally away from the GPU, instead of just through its face. The copper face on the heat spreader is much larger than the GPU, which tells me that more lateral heat spreading is needed.
Also, I was wondering if anyone has experience undervolting at idle for the GPU. I might not have a chance to fix this right away and I want to do everything I can. I added speculative voltages to the attachment, because .06V increments would make sense to fill the gap between 1 and 1.24.
Any thoughts? Thanks in advance.






