do you guys agree with this guy on the airflow?
Air gaps from Dell's stock setup of heatsinks
Now this was something I was not happy about. There is a large gap from the left fan (fan 1) to the CPU's heatsink from before. Then there was now a gap between the CPU and GPU's heatsinks. You can see in the picture above the screwdriver that is clearly visible (click the image for the full-res version).
In my history of custom cooling back in the 80s and 90s, there is one thing I learned that always remains constant: airflow is key. So my task would be to modify the airflow to force all air through the heatsinks by not allowing any to escape the airflow path through any gaps.
Aluminum Foil Shrouds
I accomplished this by using a few pieces of kitchen aluminum foil, scotch-tape, and additional AS5. There are multiple reasons for this. First for safety I evaluated the entire area and found no electrical components or circuit boards anywhere near this area. You do not want a piece coming loose and short-circuiting things!
Second is having aluminum foil allows the heat to transfer from one copper pipe to the other (just a tad though, too thin really to do a massive amount). That may not have been the best idea at first because CPUs usually run cooler than GPUs from my overclocking experience. But considering how freakin' high my CPU temps were before I even began, I could only see this as helping to offload some heat to the GPU's heatpipe - even if just a tad amount, anything had to help.
I also closed down the air escaping on the left side of fan's outlet to the CPU's heatsink, as well as the gaps between the two heatsinks. Now all air is forced by the fan trough the CPU heatsink, and then through the GPU's heatsink where it than only has room to exit the back vent.
His argument is sound. So yes! A tight (no leak) air flow is better in dissipating heat.
|I also closed down the air escaping on the left side of fan's outlet to the CPU's heatsink, as well as the gaps between the two heatsinks. Now all air is forced by the fan trough the CPU heatsink, and then through the GPU's heatsink where it than only has room to exit the back vent.|
Scotch tape? Really scotch tape does not catch anyones eye? Is electrical tape that expensive. I don't see scotch tape holding up well in there. I see hard useless varnish on some components in short order. That's going to be fun to clean up.
I think this is a fine modification but I can see why MFG's do not do. And it is not cheapness it is more a matter of practicality. Some might argue that is cheapness I beg to differ. While both do come down to cost the main determining factor is different. This modification is not practical to do at the plant but yes very easy for the individual. Does not disassemble well, at least not in professional sense. A modular form and something similar to a gasket or rubber seal would be the way an ODM would likely do. Desktop guys have to do much to modify there set ups. That is what you do when you want to operate above specs. Either pushing the system beyond specs and maintaining adequate thermal conditions or running as cool as possible while not pushing other components.
The goal of the ODM is to make a system that meets certain criteria not to get the absolute max out of everything. I prefer not having ODM spend money on this I will do it myself. Adding $20/$30 per unit adds a lot when we are talking 100,000 units.
Welcome to the wonderful world of notebook modding. But why bash the MFG? Modding gives you something to do. People do it with cars and don't bash the MFG why do we computer guys insist on doing it. It's a great hobby enjoy it.