do you guys agree with this guy on the airflow?
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His argument is sound. So yes! A tight (no leak) air flow is better in dissipating heat.
cheers ... |
| I also closed down the air escaping on the left side of fan's outlet to the CPU's heatsink, as well as the gaps between the two heatsinks. Now all air is forced by the fan trough the CPU heatsink, and then through the GPU's heatsink where it than only has room to exit the back vent. |

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Scotch tape? Really scotch tape does not catch anyones eye? Is electrical tape that expensive. I don't see scotch tape holding up well in there. I see hard useless varnish on some components in short order. That's going to be fun to clean up.
I think this is a fine modification but I can see why MFG's do not do. And it is not cheapness it is more a matter of practicality. Some might argue that is cheapness I beg to differ. While both do come down to cost the main determining factor is different. This modification is not practical to do at the plant but yes very easy for the individual. Does not disassemble well, at least not in professional sense. A modular form and something similar to a gasket or rubber seal would be the way an ODM would likely do. Desktop guys have to do much to modify there set ups. That is what you do when you want to operate above specs. Either pushing the system beyond specs and maintaining adequate thermal conditions or running as cool as possible while not pushing other components. The goal of the ODM is to make a system that meets certain criteria not to get the absolute max out of everything. I prefer not having ODM spend money on this I will do it myself. Adding $20/$30 per unit adds a lot when we are talking 100,000 units. Welcome to the wonderful world of notebook modding. But why bash the MFG? Modding gives you something to do. People do it with cars and don't bash the MFG why do we computer guys insist on doing it. It's a great hobby enjoy it. ![]() |