Hynix Semiconductor Inc. announced that it has begun mass producing 64Gigabit (‘Gb’) NAND Flash using 20nm class technology at its 300mm Fabrication, M11 in Cheo ngju site.
The Company developed this cutting edge technology last February.
Hynix’s 20nm class 64Gb chip doubles the density in a package over the current 32Gb product. 20nm class process technology also provides a 60% increase in productivity over Hynix's existing 30nm class technology. By providing these high density and cost efficient chips, Hynix will respond to the needs of advanced mobile solutions which require smaller size and higher density storage capacity.
Source.
The Company developed this cutting edge technology last February.
Hynix’s 20nm class 64Gb chip doubles the density in a package over the current 32Gb product. 20nm class process technology also provides a 60% increase in productivity over Hynix's existing 30nm class technology. By providing these high density and cost efficient chips, Hynix will respond to the needs of advanced mobile solutions which require smaller size and higher density storage capacity.
Quote:
| "Hynix decided to mass produce the industry’s highest density64Gb chips using 20nm class technology in order to fully satisfy demand from the customers. With these 20nm class 64Gb chips, the Company is enabled to provide customized, high performance products in a timely manner which perfectly suitsmobile solutions including smartphones, table PCs and others,” |
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