The folks at overclocker.com have been playing with the Ivy Bridge and came to a conclusion that the CPU does indeed run hot when overclocked. But why?
Why is Ivy Bridge so hot? Ask that question in any forum currently, and you are likely to receive one of two different popular (but not entirely correct) answers that everyone has been parroting:
1. “Power density is greater on Ivy Bridge than Sandy Bridge”
2. “Intel has problems with tri-gate/22nm”
The first answer is correct, but wrong at the same time – power density is greater, but it isn’t what is causing temperatures to be as much as 20 °C higher on Ivy Bridge compared to Sandy Bridge when overclocked. The second answer is jumping to conclusions without sufficient evidence.
So why is Ivy Bridge hot?
Intel is using TIM paste between the Integrated Heat Spreader (IHS) and the CPU die on Ivy Bridge chips, instead of fluxless solder.
How does TIM paste generally compare with fluxless solder for conducting heat? Heat conductivity can be measured in watts per meter Kelvin. To be technically exact, we would need to know exactly what Intel is using for TIM paste/solder. When I went to Intel and asked, their polite answer may not surprise you – “Secret sauce”! Given that, we can use some rough approximations. A solder attach could have a heat conductivity in the range of 80 W/mK. A TIM paste could have a heat conductivity in the range of 5 W/mK. That’s your problem right there! Note that these values are not exact, as we don’t know the exact heat conductivity of Intel’s “Secret sauce”. However, these are values representative of solder or TIM paste, and there is a giant gap between how TIM paste and solder perform in regards to conducting heat. They are in different leagues.
Source
What do you say? Hold off on these so called Ivy Bridge systems if you are gamers and OCers until there is a clear explanation and solution?
cheers ...
Why is Ivy Bridge so hot? Ask that question in any forum currently, and you are likely to receive one of two different popular (but not entirely correct) answers that everyone has been parroting:
1. “Power density is greater on Ivy Bridge than Sandy Bridge”
2. “Intel has problems with tri-gate/22nm”
The first answer is correct, but wrong at the same time – power density is greater, but it isn’t what is causing temperatures to be as much as 20 °C higher on Ivy Bridge compared to Sandy Bridge when overclocked. The second answer is jumping to conclusions without sufficient evidence.
So why is Ivy Bridge hot?
Intel is using TIM paste between the Integrated Heat Spreader (IHS) and the CPU die on Ivy Bridge chips, instead of fluxless solder.
How does TIM paste generally compare with fluxless solder for conducting heat? Heat conductivity can be measured in watts per meter Kelvin. To be technically exact, we would need to know exactly what Intel is using for TIM paste/solder. When I went to Intel and asked, their polite answer may not surprise you – “Secret sauce”! Given that, we can use some rough approximations. A solder attach could have a heat conductivity in the range of 80 W/mK. A TIM paste could have a heat conductivity in the range of 5 W/mK. That’s your problem right there! Note that these values are not exact, as we don’t know the exact heat conductivity of Intel’s “Secret sauce”. However, these are values representative of solder or TIM paste, and there is a giant gap between how TIM paste and solder perform in regards to conducting heat. They are in different leagues.
Source
What do you say? Hold off on these so called Ivy Bridge systems if you are gamers and OCers until there is a clear explanation and solution?
cheers ...
