Apologizes for providing a reply so late, but if I may;
The HP Pavilion dv2000 series, Pavilion dv6000 series, and Pavilion dv9000 series, has a problem with inadequate cooling for the graphics chipset.
The cooling system consists of;
1) Cooling Tube:
Slightly flattened copper tube sealed on both ends, and filled with Nitrogen.
One end has two small metal plates attached along it. One plate sits on top of the Processor, the other plate sits on top of the GPU. (Graphics Processing Unit, or graphics chipset)
The other end of the Cooling Tube is connected to the Heatsink.
Small strip of metal that has tall, thin fins protruding from it. Rectangular in shape.
3) Fan Assembly:
Fan inside a shroud. (Surrounding cage)
The two metal plates absorb heat from the Processor, and GPU. The heat is then absorbed by the Cooling Tube, and transferred up to the Heatsink.
The Heatsink absorbs the heat, then radiates it away with it's tall, thin fins.
Air flow from the Fan Assembly, helps carry heat away from the fins of the Heatsink.
The small plate that resides on the GPU, is inadequate in surface area. Too small.
This allows the GPU to overheat.
The GPU's circuit board is mounted to the motherboard, via a BGA surface mount. Ball Grid Array.
To explain the BGA surface mount, compare to an older Intel Pentium 4 processor, that uses a Socket 478 socket.
The Intel Pentium 4 processor has contact pins on the bottom. 478 of 'em.
The Socket 478 processor socket has matching socket holes. (478)
With a BGA surface mount, there are no contact pins nor socket holes. In place of the contact pins there are Solder Balls. In place of the socket holes there are Copper Pads.
(These are gold plated also)
The graphics chipset (GPU) is set into place on the motherboard, with the Solder Balls lining up with the Copper Pads.
Heat is then applied at a specific temperature, and length of time. This action melts the solder balls, and solders the graphics chipset to the copper pads.
(Which in turn solders the graphics chipset TO the motherboard)
With the graphics chipset constantly overheating, then cooling down, (Laptop turned off), the solder connections that were made turn into cold solder joints.
A cold solder joint results in a poor contact, or no contact at all. This means the graphics chipset has a poor contact with the motherboard.
IMHO buying the same t3rd of a motherboard again, will result in the same problem. There is a solution, however.
1) Properly reheat the graphics chipset, and make those solder joints good again.
2) Add more surface area to the metal plate, that resides on the graphics chipset.
The PROPER method of reflowing the graphics chipset, is to use a BGA Rework Machine. Not something you have in your backpocket, or in the average computer repair shop.
The laptop manufacturers when repairing the problem, send the motherboard to their depot. This is a laugh, because they send the motherboard to a shop, that has a BGA Reflow machine, plus skills, and experience.
I just want to show you one person's method of repairing the problem, and want you to know I am NOT advertising for said person, nor subscribe to the reflow method used in the video.
View the video for REFERENCE, (In the persons behalf however, he does state in - Show more - that the proper method is to use a BGA Rework Machine, when referring to the dv6000 series),
A look at a BGA Rework Machine at work,
..................and now Bob back to you.........