What are Vapor Chambers?
Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs at safe operating temperatures, extending the components and products life.
How do Vapor Chambers work?
As the coolant molecules are heated they change phases. The vaporized coolant convects freely through the chamber. The Molecules then condense on cold surfaces, dissipate their heat load, and are channeled back to the coolant reservoir. Since the rate of condensation depends on the temperature delta of the coolant and the contact surface, the coolant automatically streams towards the coolest surface area. This self-organizing active molecular coolant stream within the Vapor Chamber is responsible for its superior thermal properties. As a result it provides stable and evenly spread temperatures on all of its surfaces, regardless of the location and density of the heat source below the chamber base.
Press release ...
Cooler Master announces further integration of Vapor Chambers into its retail Heatsinks.
After releasing the world's first heatpipe heatsink in 2000, and the first vertical vapor chamber Heatsink in early 2012, Cooler Master today announces broader adoption of Vapor Chamber Technology developed by Cooler Master's OEM and industrial cooling division in its retail Heatsinks. After the success of the TPC812 pioneering the use of modern vertical vapor chambers, Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers.
Horizontal Vapor Chambers spread Heat 8x faster than solid copper, eliminating hot spots and spreading heat evenly across the base of a heatsink. Since the vapor chamber effectively increases the heatpipe contact area, it allows the use of a larger number of heatpipes. Overall Horizontal Vapor Chambers enable faster and more efficient transfer of heat from the CPU to the heatpipes and fins, resulting in lower temperatures and slower, less noisy fans.
Modern processors feature multiple CPU cores and integrated GPUs, resulting in hotspots, tiny parts of the CPU that product significantly more heat than others. Thanks to advanced thermal management, processors can boost the speed of individual cores if the processor is cooled well enough. Horizontal vapor chambers help eliminate hotspots and remove heat at unprecedented speeds, allowing your CPU to boost its performance and notably improve system performance.
Vertical Vapor Chambers allow Cooler Master to develop Heatsinks that help your system run cooler, quieter, and faster. The first Cooler Master Heatsink equipped with a horizontal vapor chamber, the V4 GT, will be officially released to the market in Q3, 2012.
Vapor Chambers provide far superior thermal performance than traditional solid metal Heat spreaders at reduced weight and height. Thermal spread resistance is almost neglectable and thermal resistance is x times lower than (refer to copper, carbon nanotube compound, nano diamond compound). Vapor Chambers enable higher component heat densities and TDPs at safe operating temperatures, extending the components and products life.
How do Vapor Chambers work?
As the coolant molecules are heated they change phases. The vaporized coolant convects freely through the chamber. The Molecules then condense on cold surfaces, dissipate their heat load, and are channeled back to the coolant reservoir. Since the rate of condensation depends on the temperature delta of the coolant and the contact surface, the coolant automatically streams towards the coolest surface area. This self-organizing active molecular coolant stream within the Vapor Chamber is responsible for its superior thermal properties. As a result it provides stable and evenly spread temperatures on all of its surfaces, regardless of the location and density of the heat source below the chamber base.
Press release ...
Cooler Master announces further integration of Vapor Chambers into its retail Heatsinks.
After releasing the world's first heatpipe heatsink in 2000, and the first vertical vapor chamber Heatsink in early 2012, Cooler Master today announces broader adoption of Vapor Chamber Technology developed by Cooler Master's OEM and industrial cooling division in its retail Heatsinks. After the success of the TPC812 pioneering the use of modern vertical vapor chambers, Cooler Master is expanding the TPC series and will equip selected Models of the V series with Horizontal Vapor Chambers.
Horizontal Vapor Chambers spread Heat 8x faster than solid copper, eliminating hot spots and spreading heat evenly across the base of a heatsink. Since the vapor chamber effectively increases the heatpipe contact area, it allows the use of a larger number of heatpipes. Overall Horizontal Vapor Chambers enable faster and more efficient transfer of heat from the CPU to the heatpipes and fins, resulting in lower temperatures and slower, less noisy fans.
Modern processors feature multiple CPU cores and integrated GPUs, resulting in hotspots, tiny parts of the CPU that product significantly more heat than others. Thanks to advanced thermal management, processors can boost the speed of individual cores if the processor is cooled well enough. Horizontal vapor chambers help eliminate hotspots and remove heat at unprecedented speeds, allowing your CPU to boost its performance and notably improve system performance.
Vertical Vapor Chambers allow Cooler Master to develop Heatsinks that help your system run cooler, quieter, and faster. The first Cooler Master Heatsink equipped with a horizontal vapor chamber, the V4 GT, will be officially released to the market in Q3, 2012.
