Thank you snorre.
Another question
What is the difference and the importance of the following characteristics of the memory modules
configuration (module size) 64M x 64bits and
component config (die size) 32M x 16
(the numbers are typical)
to the compliance with the ferrari chipset?
For instance, Micron offers
MT8VDDT6464HDG-40B PC3200 with config 64 Meg x 64 and component config 32 Meg x 16 and
MT8VDDT6464HG-40B PC3200 with config 64 Meg x 64 and component config 64 Meg x 8
also
MT9VDDT6472HG-40B PC3200 with config 64 Meg x 72 and component config 64 Meg x 8
Do these configuration differences might be a problem to installing and proper functioning of the module. (Of course, all of the abovelisted modules are 200 pin SO-DIMM)
Snorre, obviously all PC3200 use 2.6 V supply in contrast to PC2700 that use 2.5 V will this be a problem, and did you have any problems with the this?
Another question
What is the difference and the importance of the following characteristics of the memory modulesconfiguration (module size) 64M x 64bits and
component config (die size) 32M x 16
(the numbers are typical)
to the compliance with the ferrari chipset?
For instance, Micron offers
MT8VDDT6464HDG-40B PC3200 with config 64 Meg x 64 and component config 32 Meg x 16 and
MT8VDDT6464HG-40B PC3200 with config 64 Meg x 64 and component config 64 Meg x 8
also
MT9VDDT6472HG-40B PC3200 with config 64 Meg x 72 and component config 64 Meg x 8
Do these configuration differences might be a problem to installing and proper functioning of the module. (Of course, all of the abovelisted modules are 200 pin SO-DIMM)
Snorre, obviously all PC3200 use 2.6 V supply in contrast to PC2700 that use 2.5 V will this be a problem, and did you have any problems with the this?





