Mobmeter 63 C while playing Half Life?

12 hours of straight playing time gives me 63 to max 65C.. its a prescott..im sure if they hadn't put AS5 on it, it would hit 70C easily..

Horses mouth: ftp://download.intel.com/design/Pent...s/30235103.pdf
(Page 73)
Thermal Specifications
To allow for the optimal operation and long-term reliability of Intel processor-based systems, the
system/processor thermal solution should be designed such that the processor remains within the
minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 5-1. Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, refer to the appropriate
processor thermal design guidelines.
The Pentium 4 processor in the 775-land package introduces a new methodology for managing
processor temperatures which is intended to support acoustic noise reduction through fan speed
control. Selection of the appropriate fan speed will be based on the temperature reported by the
processor’s thermal diode. If the diode temperature is greater than or equal to Tcontrol then the
processor case temperature must remain at or below the temperature as specified by the thermal
profile. If the diode temperature is less than Tcontrol then the case temperature is permitted to
exceed the thermal profile, but the diode temperature must remain at or below Tcontrol. Systems
that implement fan speed control must be designed to take these conditions into account. Systems
that do not alter the fan speed only need to guarantee the case temperature meets the thermal profile
specifications.
To determine a processor's case temperature specification based on the thermal profile, it is
necessary to accurately measure processor power dissipation.
74 Datasheet
Thermal Specifications and Design Considerations
The case temperature is defined at the geometric top center of the processor IHS. Analysis indicates
that real applications are unlikely to cause the processor to consume maximum power dissipation for
sustained periods of time. Intel recommends that complete thermal solution designs target the
Thermal Design Power (TDP) indicated in Table 5-1 instead of the maximum processor power
consumption. The Thermal Monitor feature is intended to help protect the processor in the unlikely
event that an application exceeds the TDP recommendation for a sustained period of time. For more
details on the usage of this feature, refer to Section 5.2. In all cases, the Thermal Monitor feature
must be enabled for the processor to remain within specification.
Table 5-1. Processor Thermal Specifications
Processor
Number
Core Frequency
(GHz)
Thermal Design
Power (W)
Minimum TC
(°C) Maximum TC (°C) Notes
520 2.80 (PRB = 0) 84 5 See Table 5-3 and Figure 5-2 1, 2
530 3 (PRB = 0) 84 5 See Table 5-3 and Figure 5-2 1, 2
540 3.20 (PRB = 0) 84 5 See Table 5-3 and Figure 5-2 1, 2
550 3.40 (PRB = 0) 84 5 See Table 5-3 and Figure 5-2 1, 2
550 3.40 (PRB = 1) 115 5 See Table 5-2 and Figure 5-1 1, 2
NOTES:
1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power
that the processor can dissipate.
2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the
maximum Tc will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table
for the allowed combinations of power and Tc.
560 3.60 (PRB = 1) 115 5 See Table 5-2 and Figure 5-1 1, 2
570 3.80 (PRB = 1) 115 5 See Table 5-2 and Figure 5-1 1, 2
Table 5-2. Thermal Profile for Processors with PRB = 1 (Sheet 1 of 2)
Power (W) Maximum Tc (°C) Power Maximum Tc (°C)
0 44.0 60 59.0
2 44.5 62 59.5
4 45.0 64 60.0
6 45.5 66 60.5
8 46.0 68 61.0
10 46.5 70 61.5
12 47.0 72 62.0
14 47.5 74 62.5
16 48.0 76 63.0
18 48.5 78 63.5
20 49.0 80 64.0
22 49.5 82 64.5
24 50.0 84 65.0
26 50.5 86 65.5
28 51.0 88 66.0
30 51.5 90 66.5
Datasheet 75
Thermal Specifications and Design Considerations
32 52.0 92 67.0
34 52.5 94 67.5
36 53.0 96 68.0
38 53.5 98 68.5
40 54.0 100 69.0
42 54.5 102 69.5
44 55.0 104 70.0
46 55.5 106 70.5
48 56.0 108 71.0
50 56.5 110 71.5
52 57.0 112 72.0
54 57.5 114 72.5
56 58.0 115 72.8
58 58.5
Figure 5-1. Thermal Profile for Processors with PRB = 1
Table 5-2. Thermal Profile for Processors with PRB = 1 (Sheet 2 of 2)
Power (W) Maximum Tc (°C) Power Maximum Tc (°C)
y = 0.25x + 44
40.0
45.0
50.0
55.0
60.0
65.0
70.0
75.0
0 10 20 30 40 50 60 70 80 90 100 110
Power (W) Tcase (
C)
76 Datasheet
Thermal Specifications and Design Considerations
Table 5-3. Thermal Profile for Processors with PRB = 0
Power (W) Maximum Tc (°C) Power Maximum Tc (°C)
0 44.2 44 56.5
2 44.8 46 57.1
4 45.3 48 57.6
6 45.9 50 58.2
8 46.4 52 58.8
10 47.0 54 59.3
12 47.6 56 59.9
14 48.1 58 60.4
16 48.7 60 61.0
18 49.2 62 61.6
20 49.8 64 62.1
22 50.4 66 62.7
24 50.9 68 63.2
26 51.5 70 63.8
28 52.0 72 64.4
30 52.6 74 64.9
32 53.2 76 65.5
34 53.7 78 66.0
36 54.3 80 66.6
38 54.8 82 67.2
40 55.4 84 67.7
42 56.0

My 4780 ranged from 40-60. Usually 53 something while idling with bursts to 64 while gaming and then the fans would kick in and bring it down.